Category |
Solder |
Manufacturer |
Kester Solder |
Series |
NXG1 |
Package |
Bulk |
RoHS |
RoHs |
Form |
Jar, 17.64 oz (500g) |
Type |
Solder Paste |
Process |
Lead Free |
Diameter |
- |
Flux Type |
No-Clean |
Mesh Type |
- |
Shelf Life |
8 Months |
Wire Gauge |
- |
Composition |
Sn99.3Cu0.7 (99.3/0.7) |
Part Status |
Obsolete |
Melting Point |
441°F (227°C) |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
32°F ~ 50°F (0°C ~ 10°C) |