SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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ACC-HS3-SET

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be obtained from the product data sheet.

ACC-HS3-SET

  • Part No: ACC-HS3-SET
  • Manufacturer: Enclustra FPGA Solutions
  • In Stock: 23226
  • Description: ACC HEATSINK ME ACC-HS3
  • Shipping Date: 2026/6/20
  • Datasheet:
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
Enclustra FPGA Solutions
Series
ACC-HS3
Package
Box
RoHS
RoHs
Type
-
Shape
Rectangular
Width
1.063" (27.00mm)
Length
2.205" (56.00mm)
Diameter
-
Material
-
Fin Height
0.571" (14.50mm)
Part Status
Active
Package Cooled
-
Material Finish
-
Attachment Method
Bolt On
Thermal Resistance @ Natural
-
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-