Category |
Thermal-Heat-Sinks |
Manufacturer |
Enclustra FPGA Solutions |
Series |
ACC-HS3 |
Package |
Box |
RoHS |
RoHs |
Type |
- |
Shape |
Rectangular |
Width |
1.063" (27.00mm) |
Length |
2.205" (56.00mm) |
Diameter |
- |
Material |
- |
Fin Height |
0.571" (14.50mm) |
Part Status |
Active |
Package Cooled |
- |
Material Finish |
- |
Attachment Method |
Bolt On |
Thermal Resistance @ Natural |
- |
Power Dissipation @ Temperature Rise |
- |
Thermal Resistance @ Forced Air Flow |
- |