SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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APF19-19-13CB

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be obtained from the product data sheet.

APF19-19-13CB

  • Part No: APF19-19-13CB
  • Manufacturer: CTS Thermal Management Products
  • In Stock: 10975
  • Description: HEATSINK LOW-PROFILE FORGED
  • Shipping Date: 2026/6/22
  • Datasheet: APF19-19-13CB Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
CTS Thermal Management Products
Series
APF
Package
Box
RoHS
RoHs
Type
Top Mount
Shape
Square, Fins
Width
0.748" (19.00mm)
Length
0.748" (19.00mm)
Diameter
-
Material
Aluminum
Fin Height
0.500" (12.70mm)
Part Status
Active
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Not Included)
Thermal Resistance @ Natural
-
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
4.00°C/W @ 200 LFM