SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

 Professional Electronic Component Distributor!

Language
APF303010CBA01

Image shown is a representation only. Exact specifications should
be obtained from the product data sheet.

APF303010CBA01

  • Part No: APF303010CBA01
  • Manufacturer: CTS Thermal Management Products
  • In Stock: 14128
  • Description: HEATSINK FORGED W/ADHESIVE TAPE
  • Shipping Date: 2026/6/23
  • Datasheet: APF303010CBA01 Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
CTS Thermal Management Products
Series
APF
Package
Box
RoHS
RoHs
Type
Top Mount
Shape
Square, Fins
Width
1.181" (30.00mm)
Length
1.181" (30.00mm)
Diameter
-
Material
Aluminum
Fin Height
0.370" (9.40mm)
Part Status
Active
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Included)
Thermal Resistance @ Natural
-
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
3.30°C/W @ 200 LFM