SHENZHEN GANGXINLI ELECTRONICS CO.,LTD
Professional Electronic Component Distributor!
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SHENZHEN GANGXINLI ELECTRONICS CO.,LTD
Professional Electronic Component Distributor!
Datasheet
Category |
Thermal-Heat-Sinks |
Manufacturer |
Advanced Thermal Solutions Inc. |
Series |
dualFLOW™ |
Package |
Box |
RoHS |
RoHs |
Type |
Top Mount, Zipper Fin |
Shape |
Square, Fins |
Width |
3.626" (92.11mm) |
Length |
3.637" (92.38mm) |
Diameter |
- |
Material |
Copper |
Fin Height |
1.142" (29.00mm) |
Part Status |
Active |
Package Cooled |
Intel LGA2011 & LGA2066 CPU Cooler |
Material Finish |
Nickel |
Attachment Method |
Push Pin |
Thermal Resistance @ Natural |
- |
Power Dissipation @ Temperature Rise |
- |
Thermal Resistance @ Forced Air Flow |
- |
