SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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BDN12-5CB/A01

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be obtained from the product data sheet.

BDN12-5CB/A01

  • Part No: BDN12-5CB/A01
  • Manufacturer: CTS Thermal Management Products
  • In Stock: 16308
  • Description: HEATSINK CPU W/ADHESIVE 1.21"SQ
  • Shipping Date: 2026/7/8
  • Datasheet: BDN12-5CB/A01 Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
CTS Thermal Management Products
Series
BDN
Package
Box
RoHS
RoHs
Type
Top Mount
Shape
Square, Pin Fins
Width
1.210" (30.73mm)
Length
1.210" (30.73mm)
Diameter
-
Material
Aluminum
Fin Height
0.555" (14.10mm)
Part Status
Active
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Included)
Thermal Resistance @ Natural
16.50°C/W
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
5.20°C/W @ 400 LFM