SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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BGAH375-125E

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be obtained from the product data sheet.

BGAH375-125E

  • Part No: BGAH375-125E
  • Manufacturer: Ohmite
  • In Stock: 26617
  • Description: BGA HEATSINK W/TAPE
  • Shipping Date: 2026/6/23
  • Datasheet: BGAH375-125E Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
Ohmite
Series
BG
Package
Box
RoHS
RoHs
Type
Top Mount
Shape
Square, Angled Fins
Width
1.476" (37.50mm)
Length
1.476" (37.50mm)
Diameter
-
Material
Aluminum Alloy
Fin Height
0.492" (12.50mm)
Part Status
Active
Package Cooled
BGA, CPU, GPU
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Included)
Thermal Resistance @ Natural
3.00°C/W
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-