SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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HS02

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HS02

  • Part No: HS02
  • Manufacturer: Apex Microtechnology
  • In Stock: 25271
  • Description: HEATSINK 8P TO-3 4.5C/W
  • Shipping Date: 2026/6/20
  • Datasheet: HS02 Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
Apex Microtechnology
Series
Apex Precision Power®
Package
Bulk
RoHS
RoHs
Type
Board Level
Shape
Square, Pin Fins
Width
1.810" (45.97mm)
Length
1.810" (45.97mm)
Diameter
-
Material
Aluminum
Fin Height
1.500" (38.10mm)
Part Status
Discontinued at Digi-Key
Package Cooled
TO-3
Material Finish
Black Anodized
Attachment Method
Bolt On
Thermal Resistance @ Natural
4.50°C/W
Power Dissipation @ Temperature Rise
10.0W @ 50°C
Thermal Resistance @ Forced Air Flow
2.00°C/W @ 300 LFM