SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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HS03

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HS03

  • Part No: HS03
  • Manufacturer: Apex Microtechnology
  • In Stock: 10562
  • Description: HEATSINK 8P TO-3 1.7C/W
  • Shipping Date: 2026/6/20
  • Datasheet: HS03 Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
Apex Microtechnology
Series
Apex Precision Power®
Package
Bulk
RoHS
RoHs
Type
Board Level
Shape
Rectangular, Fins
Width
4.750" (120.65mm)
Length
3.000" (76.20mm)
Diameter
-
Material
Aluminum
Fin Height
1.250" (31.75mm)
Part Status
Discontinued at Digi-Key
Package Cooled
TO-3
Material Finish
Black Anodized
Attachment Method
Bolt On
Thermal Resistance @ Natural
1.70°C/W
Power Dissipation @ Temperature Rise
15.0W @ 30°C
Thermal Resistance @ Forced Air Flow
1.00°C/W @ 200 LFM