SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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HS09

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be obtained from the product data sheet.

HS09

  • Part No: HS09
  • Manufacturer: Apex Microtechnology
  • In Stock: 23082
  • Description: HEATSINK TO3
  • Shipping Date: 2026/6/20
  • Datasheet: HS09 Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
Apex Microtechnology
Series
Apex Precision Power®
Package
Bulk
RoHS
RoHs
Type
Board Level
Shape
Rhombus
Width
1.290" (32.77mm)
Length
1.630" (41.40mm)
Diameter
-
Material
Aluminum
Fin Height
0.750" (19.05mm)
Part Status
Discontinued at Digi-Key
Package Cooled
TO-3
Material Finish
Black Anodized
Attachment Method
Bolt On
Thermal Resistance @ Natural
11.70°C/W
Power Dissipation @ Temperature Rise
7.0W @ 80°C
Thermal Resistance @ Forced Air Flow
14.00°C/W @ 200 LFM