SHENZHEN GANGXINLI ELECTRONICS CO.,LTD
Professional Electronic Component Distributor!
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SHENZHEN GANGXINLI ELECTRONICS CO.,LTD
Professional Electronic Component Distributor!
Datasheet
Category |
Thermal-Heat-Sinks |
Manufacturer |
CUI Devices |
Series |
HSB |
Package |
Box |
RoHS |
RoHs |
Type |
Top Mount |
Shape |
Square, Pin Fins |
Width |
0.906" (23.00mm) |
Length |
0.906" (23.00mm) |
Diameter |
- |
Material |
Aluminum Alloy |
Fin Height |
0.236" (6.00mm) |
Part Status |
Active |
Package Cooled |
BGA |
Material Finish |
Black Anodized |
Attachment Method |
Adhesive |
Thermal Resistance @ Natural |
25.46°C/W |
Power Dissipation @ Temperature Rise |
3.0W @ 75°C |
Thermal Resistance @ Forced Air Flow |
9.60°C/W @ 200 LFM |
