SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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HSS08-B18-CP

Image shown is a representation only. Exact specifications should
be obtained from the product data sheet.

HSS08-B18-CP

  • Part No: HSS08-B18-CP
  • Manufacturer: CUI Devices
  • In Stock: 10258
  • Description: HEAT SINK, STAMPING, TO-218, 44.
  • Shipping Date: 2026/6/26
  • Datasheet: HSS08-B18-CP Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
CUI Devices
Series
HSS
Package
Box
RoHS
RoHs
Type
Board Level, Vertical
Shape
Square
Width
1.750" (44.45mm)
Length
1.750" (44.45mm)
Diameter
-
Material
Aluminum Alloy
Fin Height
0.492" (12.50mm)
Part Status
Active
Package Cooled
TO-218
Material Finish
Black Anodized
Attachment Method
PC Pin
Thermal Resistance @ Natural
7.29°C/W
Power Dissipation @ Temperature Rise
10.3W @ 75°C
Thermal Resistance @ Forced Air Flow
3.50°C/W @ 200 LFM