SHENZHEN GANGXINLI ELECTRONICS CO.,LTD
Professional Electronic Component Distributor!
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SHENZHEN GANGXINLI ELECTRONICS CO.,LTD
Professional Electronic Component Distributor!
Datasheet
Category |
Embedded-Microcontrollers |
Manufacturer |
NXP USA Inc. |
Series |
LPC3100 |
Package |
Tray |
RoHS |
RoHs |
Speed |
208MHz |
RAM Size |
64K x 8 |
Core Size |
16/32-Bit |
EEPROM Size |
- |
Part Status |
Obsolete |
Peripherals |
DMA, PWM, WDT |
Connectivity |
EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG |
Mounting Type |
Surface Mount |
Number of I/O |
55 |
Core Processor |
ARM9® |
Package / Case |
320-LFBGA |
Data Converters |
A/D 3x10b |
Oscillator Type |
External |
Program Memory Size |
- |
Program Memory Type |
ROMless |
Operating Temperature |
-40°C ~ 85°C (TA) |
Supplier Device Package |
320-LFBGA (13x13) |
Voltage - Supply (Vcc/Vdd) |
1.1V ~ 3.3V |
