SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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LTN20069

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LTN20069

  • Part No: LTN20069
  • Manufacturer: Wakefield-Vette
  • In Stock: 11553
  • Description: HEAT SINK BGA/PGA 16.5X16.5X8.9
  • Shipping Date: 2026/6/24
  • Datasheet: LTN20069 Datasheet
  • Category:Thermal-Heat-Sinks
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Thermal-Heat-Sinks
Manufacturer
Wakefield-Vette
Series
Penguin
Package
Bulk
RoHS
RoHs
Type
Board Level
Shape
Square, Fins
Width
0.653" (16.59mm)
Length
0.650" (16.51mm)
Diameter
-
Material
Aluminum
Fin Height
0.350" (8.89mm)
Part Status
Active
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Material Finish
Black Anodized
Attachment Method
Thermal Tape, Adhesive (Included)
Thermal Resistance @ Natural
-
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
8.00°C/W @ 500 LFM