SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

SHENZHEN GANGXINLI ELECTRONICS CO.,LTD

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TSX713

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TSX713

  • Part No: TSX713
  • Manufacturer: EDSYN INCORPORATED
  • In Stock: 13975
  • Description: REFLOW VACUUM TIP, HOLE DIA: 1.3
  • Shipping Date: 2026/6/21
  • Datasheet:
  • Category:Soldering-desoldering-rework-tips-nozzles
  • Lead-Time:Contact Our sales representative Email:sales@keepboomingtech.com
Category
Soldering-desoldering-rework-tips-nozzles
Manufacturer
EDSYN INCORPORATED
Series
SOLDAVAC®
Package
Bag
RoHS
RoHs
Width
-
Height
-
Length
0.551" (14.00mm)
Diameter
0.051" (1.30mm)
Tip Type
Rework
Tip Shape
Nozzle
Part Status
Active
Tip Chip Size
-
Temperature Range
-
For Use With/Related Products
-