EPF10K30RC240‑4N: FLEX‑10K family high-density FPGA for system-level logic integration
Product Overview and Core Specifications
Based on the mature 0.42μm CMOS process, EPF10K30RC240‑4N is a member of the FLEX‑10K family, packaged as QFP‑240 with exposed solder thermal pad. The FPGA contains 216 logic array blocks (LABs), a total of 1728 logic elements, with 12kbit RAM embedded in the array and powerful I/O support, a total of 189 general I/O ports, which is very suitable for system sequential logic and multi-protocol conversion modules.
Logic elements: 1728
Embedded RAM: 12kbit
General I/O: 189
Maximum gate level: about 69k gates
Supply voltage: 4.75V – 5.25V
Operating temperature: 0 – 70℃ (commercial grade)
Package form and pin description
Uses 240-pin QFP package, the package size is about 32×32 mm. The middle metal pad is used for heat dissipation and GND connection. The I/O pins are distributed on the edge of the QFP, providing multiple sets of VCC, GND, power and configuration pins, which can support JTAG interface, configuration line and dynamic I/O multiplexing scenarios.
System integration features
5V system compatibility: adapt to industrial and old 5V bus systems, simple migration design
Embedded RAM: suitable for register cache, small FIFO and state machine implementation
Mature support: supports Quartus II development environment, provides complete simulation, debugging and IP core support
Wide reliability: low power standby mode (≤0.5mA), stable welding performance
Typical application suggestions
Protocol bridging and logic integration: such as multiple serial protocol conversion, communication protocol stack implementation, industrial bus interface, etc.
Real-time controller: strengthen the logic control and timing response function of MCU performance
Data interface customization: realize customized signal timing, protocol layer hardware acceleration
Embedded PLD replacement: adapt to early ASIC engineering or sequential logic replacement application
Design key points suggestions
Power supply and ground layer: it is recommended to divide multiple groups of VCC and GND power pins, and cooperate with ground flat copper and bypass capacitors
JTAG and configuration: reserve TCK/TDI/TDO/TMS interfaces, and the layout should not be crowded with high-speed signal lines
I/O design: I/O Supports 5V compatibility, suitable for TTL signal or high voltage interface environment
Heat dissipation suggestion: The central pad should be connected to the thermal via of the PCB ground layer to help heat dissipation
Simulation development: Using Quartus II to provide SOPC Builder/IP integration tools can efficiently integrate system functions
Reliability considerations: As a discontinued device, it is recommended to pay attention to the alternative EPF10K30E or plug-and-play solutions in the design
Compatible model comparison
Model Logic element RAM Bits I/O pins Package Process
EPF10K30RC240‑4N 1728 12kbit 189 QFP‑240 0.42μm
EPF10K20RC208‑4N ~1152 ~8kbit 150 QFP‑208 Same as above
EPF10K50RC260‑4N ~2880 ~20kbit 225 QFP‑260 Same as above
Cyclone® series (upgrade replacement) Higher More Multiple Packages New Process Support Low Voltage
Summary
The EPF10K30RC240‑4N is a mature and stable industrial-grade FPGA suitable for application scenarios with clear requirements for logic density, I/O quantity, and 5V compatibility. Its rich logic resources and embedded RAM support make it particularly suitable for embedded system control, custom protocol implementation, and industrial interface integration design. Although it is a discontinued model, it is still widely used in maintaining old systems and long-term inventory projects.
